FJ

            DATA SHEET

   Power chips

       JS005        

Absolute Maximum Ratings

Symbol

Conditions

Values

Units

V_DRM

T_vj = 25 °C, I_D = 0.05 mA

1200～1600

V

V_RRM

T_vj = 25 °C, I_R = 0.05 mA

1200～1600

v

I_T(AV)

T_c = 80 °C, T_vjmax = 125 °C

10

A

I_TSM

T_vjmax = 125 °C, 10 ms, half sine wave

180

A

I²t

T_vjmax = 125 °C, 10 ms, half sine wave

360

A²s

THYRISTOR

T_vjmax

+ 125

°C

Corner gate

Electrical Characteristics

Symbol

Conditions

Min.

typ.

max.

Units

V_T

T_vj = 25 °C, I_T = 30A

1.81

V

I_T(AV) = 10A

V_T(TO)

T_vjmax = 125°C

1

V

V_RRM = 1600 V

I_GT

T_vj = 25 °C

100

mA

Size: 5.0 mm X 5.0 mm

V_GT

T_vj = 25 °C

1.65

V

I_GD

T_vj = 115 °C

6

mA

V_GD

T_vj = 125 °C

0.25

V

Features

I_H

T_vj = 25 °C

165

mA

I_L

T_vj = 25 °C

330

mA

l         high current density due to double mesa technology

I_R,I_D

T_vjmax = 125°C

4

mA

Dynamic Characteristics

l         high surge current

Symbol

Conditions

Min.

Typ.

Max.

Units

l         compatible to all standard solder processes

t_q

T_vjmax = 125 °C

150

µs

(di / dt)_cr

T_vjmax = 125 °C

50

A / µs

(dv / dt)_cr

T_vjmax = 125 °C

1000

V / µs

Typical Applications

Thermal Characteristics

Symbol

Conditions

Min.

Typ.

Max.

Units

l         controlled rectifier circuits

T_vj

- 40

+ 125

°C

l         solid state relays

T_stg

- 40

+ 125

°C

l          temperature control

T_solder

+ 255

°C

l          professional light dimming

R_th(j-c)

0.51

K / W

Mechanical Characteristics

Parameter

Units

raster size

5.0 x 5.0

mm

Area total

25

mm²

Chips / tray

148

pcs

Anode metallisation

solderable

Gate and Cathode metallisation

solderable

wire bond